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| MOTOROLA SEMICONDUCTOR TECHNICAL DATA Octal 3-State Non-Inverting Buffer/Line Driver/ Line Receiver High-Performance Silicon-Gate CMOS The MC54/74HC541A is identical in pinout to the LS541. The device inputs are compatible with Standard CMOS outputs. External pullup resistors make them compatible with LSTTL outputs. The HC541A is an octal non-inverting buffer/line driver/line receiver designed to be used with 3-state memory address drivers, clock drivers, and other bus-oriented systems. This device features inputs and outputs on opposite sides of the package and two ANDed active-low output enables. The HC541A is similar in function to the HC540A, which has inverting outputs. * Output Drive Capability: 15 LSTTL Loads * Outputs Directly Interface to CMOS, NMOS and TTL * Operating Voltage Range: 2 to 6V * Low Input Current: 1A * High Noise Immunity Characteristic of CMOS Devices * In Compliance With the JEDEC Standard No. 7A Requirements * Chip Complexity: 134 FETs or 33.5 Equivalent Gates LOGIC DIAGRAM MC54/74HC541A J SUFFIX CERAMIC PACKAGE CASE 732-03 1 20 20 1 N SUFFIX PLASTIC PACKAGE CASE 738-03 20 1 DW SUFFIX SOIC PACKAGE CASE 751D-04 ORDERING INFORMATION MC54HCXXXAJ MC74HCXXXAN MC74HCXXXADW Ceramic Plastic SOIC FUNCTION TABLE A1 A2 A3 A4 A5 A6 A7 A8 Output Enables OE1 OE2 2 3 4 5 6 7 8 9 1 19 18 17 16 15 14 13 12 11 Y1 Y2 Y3 Y4 Y5 Y6 Y7 Y8 OE1 L L H X Inputs Output Y OE2 L L X H A L H X X L H Z Z Data Inputs Non-Inverting Outputs Z = High Impedance X = Don't Care PIN 20 = VCC PIN 10 = GND Pinout: 20-Lead Packages (Top View) VCC 20 OE2 19 Y1 18 Y2 17 Y3 16 Y4 15 Y5 14 Y6 13 Y7 12 Y8 11 1 OE1 10/95 2 A1 3 A2 4 A3 5 A4 6 A5 7 A6 8 A7 9 A8 10 GND (c) Motorola, Inc. 1995 3-1 REV 1 IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I III I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I III I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I IIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIIIII III IIIIIIIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIIIII MC54/74HC541A MAXIMUM RATINGS* Symbol VCC Vin Parameter Value Unit V V V DC Supply Voltage (Referenced to GND) DC Input Voltage (Referenced to GND) - 0.5 to + 7.0 - 0.5 to VCC + 0.5 - 0.5 to VCC + 0.5 20 35 75 750 500 Vout Iin DC Output Voltage (Referenced to GND) DC Input Current, per Pin mA mA mA Iout DC Output Current, per Pin ICC PD DC Supply Current, VCC and GND Pins Power Dissipation in Still Air, Plastic or Ceramic DIP SOIC Package Storage Temperature Range mW Tstg TL - 65 to + 150 260 300 _C _C This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, Vin and Vout should be constrained to the range GND (Vin or Vout) VCC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open. v v Lead Temperature, 1 mm from Case for 10 Seconds Plastic DIP or SOIC Package Ceramic DIP) * Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions. Derating -- Plastic DIP: - 10 mW/_C from 65_ to 125_C Ceramic DIP: - 10 mW/_C from 100_ to 125_C SOIC Package: - 7 mW/_C from 65_ to 125_C For high frequency or heavy load considerations, see Chapter 2 of the Motorola High-Speed CMOS Data Book (DL129/D). IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII III I III I I I I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII I I III I I III I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIII II I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIII II I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII III I RECOMMENDED OPERATING CONDITIONS Symbol VCC Parameter Min 2.0 0 Max 6.0 Unit V V DC Supply Voltage (Referenced to GND) Vin, Vout TA DC Input Voltage, Output Voltage (Referenced to GND) Operating Temperature Range, All Package Types Input Rise/Fall Time (Figure 1) VCC - 55 0 0 0 + 125 1000 500 400 _C ns tr, tf VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V DC CHARACTERISTICS (Voltages Referenced to GND) Symbol VIH Parameter Minimum High-Level Input Voltage Condition Vout = 0.1V |Iout| 20A VCC V 2.0 3.0 4.5 6.0 2.0 3.0 4.5 6.0 2.0 4.5 6.0 Guaranteed Limit -55 to 25C 1.50 2.10 3.15 4.20 0.50 0.90 1.35 1.80 1.9 4.4 5.9 2.48 3.98 5.48 0.1 0.1 0.1 0.26 0.26 0.26 85C 1.50 2.10 3.15 4.20 0.50 0.90 1.35 1.80 1.9 4.4 5.9 2.34 3.84 5.34 0.1 0.1 0.1 0.33 0.33 0.33 125C 1.50 2.10 3.15 4.20 0.50 0.90 1.35 1.80 1.9 4.4 5.9 2.20 3.70 5.20 0.1 0.1 0.1 0.40 0.40 0.40 V Unit V VIL Maximum Low-Level Input Voltage Vout = VCC - 0.1V |Iout| 20A V VOH Minimum High-Level Output Voltage Vin = VIL |Iout| 20A Vin = VIL |Iout| 3.6mA |Iout| 6.0mA |Iout| 7.8mA V 3.0 4.5 6.0 2.0 4.5 6.0 VOL Maximum Low-Level Output Voltage Vin = VIH |Iout| 20A Vin = VIH |Iout| 3.6mA |Iout| 6.0mA |Iout| 7.8mA 3.0 4.5 6.0 MOTOROLA 3-2 High-Speed CMOS Logic Data DL129 -- Rev 6 MC54/74HC541A DC CHARACTERISTICS (Voltages Referenced to GND) Symbol Iin IOZ Parameter Maximum Input Leakage Current Maximum Three-State Leakage Current Maximum Quiescent Supply Current (per Package) Condition Vin = VCC or GND Output in High Impedance State Vin = VIL or VIH Vout = VCC or GND Vin = VCC or GND Iout = 0A VCC V 6.0 6.0 Guaranteed Limit -55 to 25C 0.1 0.5 85C 1.0 5.0 125C 1.0 10.0 Unit A A ICC 6.0 4 40 160 A NOTE: Information on typical parametric values can be found in Chapter 2 of the Motorola High-Speed CMOS Data Book (DL129/D). AC CHARACTERISTICS (CL = 50 pF, Input tr = tf = 6 ns) Symbol tPLH, tPHL Parameter Maximum Propagation Delay, Input A to Output Y (Figures 1 and 3) VCC V 2.0 3.0 4.5 6.0 2.0 3.0 4.5 6.0 2.0 3.0 4.5 6.0 2.0 3.0 4.5 6.0 Guaranteed Limit -55 to 25C 80 30 18 15 110 45 25 21 110 45 25 21 60 22 12 10 10 15 85C 100 40 23 20 140 60 31 26 140 60 31 26 75 28 15 13 10 15 125C 120 55 28 25 165 75 38 31 165 75 38 31 90 34 18 15 10 15 Unit ns tPLZ, tPHZ Maximum Propagation Delay, Output Enable to Output Y (Figures 2 and 4) ns tPZL, tPZH Maximum Propagation Delay, Output Enable to Output Y (Figures 2 and 4) ns tTLH, tTHL Maximum Output Transition Time, Any Output (Figures 1 and 3) ns Cin Cout Maximum Input Capacitance Maximum Three-State Output Capacitance (Output in High Impedance State) pF pF NOTE: For propagation delays with loads other than 50 pF, and information on typical parametric values, see Chapter 2 of the Motorola High- Speed CMOS Data Book (DL129/D). Typical @ 25C, VCC = 5.0 V, VEE = 0 V pF 35 2 f + ICC VCC . For load considerations, see Chapter 2 of the * Used to determine the no-load dynamic power consumption: PD = CPD VCC Motorola High-Speed CMOS Data Book (DL129/D). CPD Power Dissipation Capacitance (Per Buffer)* SWITCHING WAVEFORMS tr 90% INPUT A tPLH 90% OUTPUT Y tTLH 50% 10% OUTPUT Y tTHL 50% HIGH IMPEDANCE tPZH tPHZ 90% VOH 50% 10% tPHL GND OUTPUT Y 50% 10% VOL tf VCC VCC OE1 or OE2 50% tPZL tPLZ 50% GND HIGH IMPEDANCE Figure 1. Figure 2. High-Speed CMOS Logic Data DL129 -- Rev 6 3-3 MOTOROLA MC54/74HC541A TEST CIRCUITS TEST POINT OUTPUT DEVICE UNDER TEST CL* DEVICE UNDER TEST OUTPUT TEST POINT 1k CONNECT TO VCC WHEN TESTING tPLZ AND tPZL. CONNECT TO GND WHEN TESTING tPHZ and tPZH. CL* *Includes all probe and jig capacitance *Includes all probe and jig capacitance Figure 3. Figure 4. PIN DESCRIPTIONS INPUTS A1, A2, A3, A4, A5, A6, A7, A8 (PINS 2, 3, 4, 5, 6, 7, 8, 9) -- Data input pins. Data on these pins appear in non-inverted form on the corresponding Y outputs, when the outputs are enabled. CONTROLS OE1, OE2 (PINS 1, 19) -- Output enables (active-low). When a low voltage is applied to both of these pins, the outputs are enabled and the device functions as an non-inverting buffer. When a high voltage is applied to either input, the outputs assume the high impedance state. OUTPUTS Y1, Y2, Y3, Y4, Y5, Y6, Y7, Y8 (PINS 18, 17, 16, 15, 14, 13, 12, 11) -- Device outputs. Depending upon the state of the output enable pins, these outputs are either non-inverting outputs or high-impedance outputs. LOGIC DETAIL To 7 Other Buffers One of Eight Buffers INPUT A VCC OUTPUT Y OE1 OE2 MOTOROLA 3-4 High-Speed CMOS Logic Data DL129 -- Rev 6 MC54/74HC541A OUTLINE DIMENSIONS J SUFFIX CERAMIC PACKAGE CASE 732-03 ISSUE E B A F C L DIM A B C D F G H J K L M N NOTES: 1. LEADS WITHIN 0.25 (0.010) DIAMETER, TRUE POSITION AT SEATING PLANE, AT MAXIMUM MATERIAL CONDITION. 2. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 3. DIMENSIONS A AND B INCLUDE MENISCUS. MILLIMETERS MIN MAX 23.88 25.15 6.60 7.49 3.81 5.08 0.38 0.56 1.40 1.65 2.54 BSC 0.51 1.27 0.20 0.30 3.18 4.06 7.62 BSC 0_ 15 _ 0.25 1.02 INCHES MIN MAX 0.940 0.990 0.260 0.295 0.150 0.200 0.015 0.022 0.055 0.065 0.100 BSC 0.020 0.050 0.008 0.012 0.125 0.160 0.300 BSC 0_ 15_ 0.010 0.040 20 1 11 10 N H D SEATING PLANE G K J M -A- 20 11 N SUFFIX PLASTIC PACKAGE CASE 738-03 ISSUE E B 1 10 C L NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. INCHES MIN MAX 1.010 1.070 0.240 0.260 0.150 0.180 0.015 0.022 0.050 BSC 0.050 0.070 0.100 BSC 0.008 0.015 0.110 0.140 0.300 BSC 0_ 15 _ 0.020 0.040 MILLIMETERS MIN MAX 25.66 27.17 6.10 6.60 3.81 4.57 0.39 0.55 1.27 BSC 1.27 1.77 2.54 BSC 0.21 0.38 2.80 3.55 7.62 BSC 0_ 15_ 0.51 1.01 -T- SEATING PLANE K M E G F D 20 PL N J 0.25 (0.010) M 20 PL 0.25 (0.010) TA M M TB M DIM A B C D E F G J K L M N -A- 20 11 DW SUFFIX PLASTIC SOIC PACKAGE CASE 751D-04 ISSUE E 10X -B- 1 10 P 0.010 (0.25) M B M NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.150 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN EXCESS OF D DIMENSION AT MAXIMUM MATERIAL CONDITION. DIM A B C D F G J K M P R MILLIMETERS MIN MAX 12.65 12.95 7.40 7.60 2.35 2.65 0.35 0.49 0.50 0.90 1.27 BSC 0.25 0.32 0.10 0.25 0_ 7_ 10.05 10.55 0.25 0.75 INCHES MIN MAX 0.499 0.510 0.292 0.299 0.093 0.104 0.014 0.019 0.020 0.035 0.050 BSC 0.010 0.012 0.004 0.009 0_ 7_ 0.395 0.415 0.010 0.029 20X D M 0.010 (0.25) TA S B J S F R X 45 _ C -T- 18X SEATING PLANE G K M High-Speed CMOS Logic Data DL129 -- Rev 6 3-5 MOTOROLA MC54/74HC541A Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters can and do vary in different applications. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer. How to reach us: USA/EUROPE: Motorola Literature Distribution; P.O. Box 20912; Phoenix, Arizona 85036. 1-800-441-2447 MFAX: RMFAX0@email.sps.mot.com -TOUCHTONE (602) 244-6609 INTERNET: http://Design-NET.com JAPAN: Nippon Motorola Ltd.; Tatsumi-SPD-JLDC, Toshikatsu Otsuki, 6F Seibu-Butsuryu-Center, 3-14-2 Tatsumi Koto-Ku, Tokyo 135, Japan. 03-3521-8315 HONG KONG: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852-26629298 MOTOROLA CODELINE 3-6 *MC54/74HC541A/D* MC54/74HC541A/D High-Speed CMOS Logic Data DL129 -- Rev 6 |
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